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Our User Guides provide step-by-step instructions on how to use our free online smart tools and other available software.
Via in Pad
The Via in Pad technology proves to be a good technique to save real estate while making the layout of the PCB thus allowing denser boards with sticking to the standard technology Design Rule parameters.
By doing so one need to be aware of:
- Solder escape/wicking phenomena
- Tombstoning effects
- Use the via filling techniques as described here
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Glossary
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