HDI pool - Eurocircuits

HDI pool – Bare board & assembly services

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Eurocircuits’ HDI Pool PCB manufacturing and assembly service enables designers to integrate microvias into their layouts for fine-pitch components, while benefiting from the cost advantages of pooling.

More frequently designers are finding that key components — previously available in standard packages — are now only available in very fine pin pitch packages.

Whilst this may only apply to one or two components on your PCB it will require complex fan-outs using via in pad (microvias) solutions.

Our HDI pool allows you to incorporate these components in your design with the necessary track widths and microvias without making the whole design a high-density interconnect layout.

Our pooling prices are based on panel-sharing, while non-pooling prices are calculated using a production panel tailored to the specific options and job.

PCBs can be supplied as single circuits or panels.

A price matrix shows alternative (lower cost) options for quantities and lead times. If your requirements are not covered, use the Place inquiry button to send your data to our engineers for evaluation.

What’s Available

- Bare Board or Assembled PCB’s
- Standard lead times:
  - Bare Board PCB’s in 12 Working Days*
  - Assembled PCB’s in 17 Working Days*
  - Shorter lead times are available in the PCB Calculator
- 8 Layers
- 100µm microvias
- Minimum annular ring: 65µm poolable or 55µm non-poolable
- Track & Gap: 100µm poolable or 90µm non-poolable
- 2 Soldermasks and 1 or 2 Legends/Silkscreens
- Surface Finish: Che Ni/Au or ENIG
- Material – Isola IS370HR FR-4 – RoHS Compliant Material Optimised for Lead-free Soldering (see also our blog about materials and lead-free soldering)
- Predefined Buildup
- No Tooling Charges
- No Minimum Order Charge
- 100% Manufacturability Check Prior to Production
- PCB Configurator to check and upload design parameters before pricing
- PCB Checker to analyses your data before you place your order
- BOM and CPL analysis

HDI pool Service Parameters
Number of Layers	8
Maximum PCB Dimension	200mm x 250mm
Minimum Dimension	5mm x 5mm for PCB’s 50mm x 50mm for Panels
Base Material (Tg – 180°C)	Isola PCL370HR (FR4)
Board Thickness (8 Layers)	1.55mm
Base Copper Foil – Outer Layers	12µm
Base Copper Foil – Inner Layers	18µm
Surface Finish	Electroless Nickel Immersion Gold (ENIG or Che Ni/Au) – Selective
Soldermask Type/Colour	Pooling – Green & no Soldermask Non-pooling – Red, Blue & Black
Extra Options	Pooling – Peelable Mask, Via Filling, Heatsink Paste, Depth Routing, Chamfered Holes, Edge Connector Bevelling, Gold Edge Connectors, Press Fit Holes
Legend Type/Colour	Pooling – White on one or both sides Non-pooling – White PIL & Black
Min. Track Width/Spacing	Pooling – 0.100mm Non-Pooling – 0.090mm
Microvia Min. Pad Size	Pooling – 0.230mm Non-Pooling – 0.210mm
Microvia Min. Landing Pad Size	Pooling – 0.230mm Non-Pooling – 0.210mm
Microvia Hole Size	0.100mm NOTE – The finished microvias will be completely filled with copper
Drilled Holes – Min. Finished Hole Size	Pooling – PTH is 0.100mm Pooling – NPTH is 0.200mm Non-Pooling – others available in the online calculatoror
Drilled Holes – Minimum Outer Layer Pad Diameter	Pooling – PTH is Finished Hole Size + 0.300mm Pooling – NPTH is Finished Hole Size + 0.200mm
Drilled Holes – Minimum Inner Layer Pad Diameter	Pooling – PTH is Finished Hole Size + 0.350mm Pooling – NPTH is Finished Hole Size + 0.250mm
Minimum Copper to Board-edge Clearance – Outer Layers	Routed – 0.250mm V-cut – 0.450mm
Minimum Copper to Board-edge Clearance– Inner Layers	Routed – 0.400mm V-cut – 0.450mm
Extra Copper Features	Copper up to Edge
Slots and Cut-outs	Tool Sizes – 0.5, 1.2, & 2.0mm
Delivered Panels	Break-routed with 2 mm Tool or V-cut
Maximum Customer Panel that can be eC-compatible	350 x 250mm
Minimum Customer Panel that can be eC-compatible	50 x 50 mm
Electrical Test	Standard
UL Marking	Not Available
Stencil Material	100µm and 130µm Stainless Steel
Maximum Stencil Size	595 x 595 mm

The HDI pool calculator starts with Default Values, as described in this article

HDI pool Assembly Service Parameters
Number of Component Layers	1 or 2
Quantities	1 PCB and up
Lead Time (minimum)	15 working days* (10 for manufacture and 5 for assembly)
Minimum PCB Dimensions	5mm x 5mm
Maximum Panel Dimensions	340mm x 440mm
Assembly Type	SMT – single or double sided THT – single or double sided SMT + THT Mixed Technology – single or double sided
Components	Passive Components – 0201 and higher Active Components – from 0,35mm pitch BGA – 0,4mm pitch and above
Solder Alloy	Basis SAC 305 Sn 96,5 Ag3 Cu 0,5 lead-free
Solder Paste Stencil	Laser cut (included in the assembly cost – not delivered with the assembled boards)
Component Sourcing	All Components Sourced by Eurocircuits (Components not sourceable by Eurocircuits can be supplied by the customer)
Quality Inspection	Visual inspection Solder Paste Inspection (SPI) BGA Placement X-ray Inspection

*Notes

Subject to design meeting our STANDARD pool manufacturing and assembly specification and component availability.
The price cannot be automatically calculated for a PCB containing more than 200 BOM lines or 1000 component placements, our engineering department will evaluate and send you an offer usually within 24 hours.
These conditions are available in our calculator/Visualizer and will only be confirmed in our order confirmation.